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EnSilica PLC on Monday said it has secured new contracts in the space communications sector and achieved a ‘milestone’ in its automotive chip programme, ahead of its annual results due Tuesday. The Oxford, England-based computer chip maker said it is currently engaged in three feasibility studies for satellite payload ASICs; two for major satellite service operators and one for a payload supplier. Each study could lead to multi-year, multi-million-pound contracts, the company noted. EnSilica also announced two new contracts with separate satellite service operators, which will integrate their constellation requirements into chips being developed under the UK Space Agency’s C-LEO programme. In total, new definition and feasibility contracts recently secured are worth more than £1.6 million in revenue, with potential for additional long-term non-recurring engineering and supply income if they move into full development. The company also won a contract to develop an enhanced radio frequency vehicle tolling prototype chip, which could lead to a large-scale supply deal with a European tolling systems provider. Separately, EnSilica said it has now delivered over 10 million ASICs for a premium automotive manufacturer, doubling its shipment volume since September 2024. The programme, first secured in 2018, highlights the firm’s capacity to ‘scale rapidly’ while maintaining recurring cash generation. Chief Executive Officer Ian Lankshear said: ‘EnSilica continues to execute strongly across our project portfolio, with a number of key programmes moving into the key implementation phases.’ Shares in EnSilica PLC were up 1.1% at 43.49 pence in London on Monday afternoon. Copyright 2025 Alliance News Ltd. All Rights Reserved.
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